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In the manufacturing method of semiconductor epitaxial cormorant-III, qualitative forecasting method and quality evaluating method are illustrated

机译:在半导体外延corⅢ的制造方法中,说明了定性预测方法和质量评价方法。

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for semiconductor epitaxial wafer having gettering ability, in which occurrence of epitaxial defect is suppressed.SOLUTION: Based on at least one set of ion injection conditions, i.e., ion species, irradiation energy, dosage, beam current value, irradiation angle, wafer temperature at the time of irradiation, and the thickness of a protective oxide film, the depth direction distribution of hole concentration or interstitial element concentration formed in a semiconductor wafer after ion implantation is calculated for at least one parameter set, and then the ion injection conditions capable of suppressing the defects occurring in an epitaxial layer are determined from the calculation results. Ions are injected into the semiconductor wafer under the ion injection conditions thus determined, before the epitaxial layer is formed.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种具有吸杂能力的半导体外延晶片的制造方法,该方法可以抑制外延缺陷的发生。解决方案:基于至少一组离子注入条件,即离子种类,照射能量,剂量,对于至少一个参数,计算出离子注入后在半导体晶片中形成的电子束电流值,照射角度,照射时的晶片温度,保护氧化膜的厚度,形成在半导体晶片中的空穴浓度或间隙元素浓度的深度方向分布。设定,然后根据计算结果确定能够抑制在外延层中发生的缺陷的离子注入条件。在形成外延层之前,在如此确定的离子注入条件下将离子注入半导体晶片中。

著录项

  • 公开/公告号JP6493104B2

    专利类型

  • 公开/公告日2019-04-03

    原文格式PDF

  • 申请/专利权人 株式会社SUMCO;

    申请/专利号JP20150173959

  • 发明设计人 奥山 亮輔;廣瀬 諒;栗田 一成;

    申请日2015-09-03

  • 分类号H01L21/322;H01L21/263;H01L21/20;H01L21/205;

  • 国家 JP

  • 入库时间 2022-08-21 12:18:56

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