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樹脂成形体およびこれを用いた半導体センサ並びに樹脂成形体の製造方法

机译:树脂成型体,使用其的半导体传感器以及树脂成型体的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a structure in which, in a resin molded body in which an insert and a thermoplastic resin are joined, concentration of vacuum voids in the vicinity of the joining interface therebetween is suppressed and a method for manufacturing the same.;SOLUTION: In a resin molded body comprising a first member 10 as an insert and a thermoplastic resin 20 as a second member covering a part of the first member 10, the first member 10 is provided with a void suppression portion 11 that covers a joint portion 10c joining to the thermoplastic resin 20 of the first member 10. As a result, the thickness of the thermoplastic resin 20 in the vicinity of the joint portion 10c is reduced, so that the concentration of the negative pressure due to cooling and solidification, and contraction of the thermoplastic resin 20 is suppressed in the vicinity, and the concentration of the vacuum voids in the joining interface between the first member 10 and the thermoplastic resin 20 is suppressed.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT
机译:解决的问题:为了提供一种结构,在该结构中,在嵌件和热塑性树脂接合的树脂成型体中,抑制了真空空隙在它们之间的接合界面附近的集中及其制造方法。 ;解决方案:在包括作为插入件的第一构件10和作为覆盖第一构件10的一部分的第二构件的热塑性树脂20的树脂成型体中,第一构件10设置有覆盖关节的空隙抑制部11。部10c与第一构件10的热塑性树脂20接合。结果,接合部10c附近的热塑性树脂20的厚度减小,从而由于冷却和凝固而引起的负压集中。从而抑制了热塑性树脂20的收缩,并且在第一构件10和热塑性树脂20之间的接合界面中的真空空隙的浓度为选定的图纸:图1;版权:(C)2019,JPO&INPIT

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