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COPPER ELECTROPLATING BATH FOR FORMING LOW STRESS FILM AND COPPER ELECTROPLATING METHOD
COPPER ELECTROPLATING BATH FOR FORMING LOW STRESS FILM AND COPPER ELECTROPLATING METHOD
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机译：形成低应力膜的铜电镀浴及铜电镀方法
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摘要
PROBLEM TO BE SOLVED: To provide a copper plating solution capable of preventing warpage of a plating film over time in electrolytic copper plating.;SOLUTION: There is provided a copper plating solution capable of obtaining a copper film that has a compressive stress exerted onto a plating film obtained from the copper bath so as to resist a tensile stress exerted onto the film over time, and therefore, keeping the film virtually free from warpage over time, by including in the copper plating solution containing a soluble copper salt and an acid: a leveler (B) comprising (a) a heterocyclic nitrogen compound having a mercapto group and (b) an organohalogen compound, or further comprising (c) a product obtained by reacting a predetermined polyalkylene glycol; or further 50-10000 mg/L of a predetermined sulfur-containing compound selected from a sulfide, a mercaptan or the like.;SELECTED DRAWING: None;COPYRIGHT: (C)2019,JPO&INPIT
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