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VIA LIFETIME CALCULATING PROGRAM, VIA LIFETIME CALCULATING METHOD, AND DEVICE THAT CALCULATES VIA LIFETIME
VIA LIFETIME CALCULATING PROGRAM, VIA LIFETIME CALCULATING METHOD, AND DEVICE THAT CALCULATES VIA LIFETIME
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机译：通过生命周期计算程序，通过生命周期计算方法以及通过生命周期计算的设备
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摘要
To provide a via lifetime calculating program capable of calculating a lifetime of a via.SOLUTION: A computer is caused to execute a process of: calculating a distortion amount Δε that represents a distortion amount occurred at a via in a printed board on the basis of a formula (1) that has variables which are a via length L, a thermal expansion rate α, a temperature change Δt, a Young's modulus E, a via diameter D, a plating thickness T, and a predetermined coefficient m; and calculating a lifetime M of the via on the basis of a formula (2) that has variables which are a number of lifetime cycles N and a number of temperature changes n. In particular, the number of lifetime cycles N satisfies N=C/Δε, x is a fatigue ductility index of a material applied for the plating, and C is a fatigue ductility coefficient of the material applied for the plating.SELECTED DRAWING: Figure 13
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机译：提供一种能够计算通孔寿命的通孔寿命计算程序。解决方案：使计算机执行以下处理：基于以下公式计算表示在印刷板中的通孔处发生的变形量的变形量Δε。具有通孔长度L，热膨胀率α，温度变化Δt，杨氏模量E，通孔直径D，镀层厚度T和预定系数m的变量的公式（1）;并基于具有变量的公式（2）计算通孔的寿命M，所述变量是寿命周期数N和温度变化数n。尤其是，寿命周期数N满足N = C /Δε，x是用于电镀的材料的疲劳延性指数，而C是用于电镀的材料的疲劳延性系数。图13
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