PROBLEM TO BE SOLVED: To provide a resin composition for abrasion machining that gives a cured film that can be cured at a low temperature of 200°C or less and yet allows fine patterning with UV laser, and yields highly reliable electronic components and semiconductor devices.;SOLUTION: A resin composition for abrasion machining using UV laser, contains (a) resin and (b) solvent, the (a) resin having a polyimide precursor structure with an imidization rate of 5% or more and less than 90%.;SELECTED DRAWING: Figure 3;COPYRIGHT: (C)2019,JPO&INPIT
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