首页> 外国专利> 加熱装置、加熱方法および基板処理装置

加熱装置、加熱方法および基板処理装置

机译:加热设备,加热方法及基板处理设备

摘要

PROBLEM TO BE SOLVED: To efficiently raise the temperature of a sheet type substrate to be processed under a vacuum in a short time and further to suppress energy consumption.;SOLUTION: The present invention relates to a heating apparatus 1 that heats a sheet type substrate S to be processed under a vacuum and that comprises: chambers 11, 21 having a first room SP1 and a second room SP2 capable of storing a substrate; a first shutter which opens and closes the first room to and from the outside space; a second shutter S2 which opens and closes the first room and second room to and from each other; first pressure reduction parts 14, 15 which reduce the pressure in the first room; second pressure reduction parts 25, 26 and 27 which reduce the pressure in the second room; carrying mechanisms 12, 22 which carry the substrate from the first room reduced in pressure to the second room reduced in pressure; a uniform heating part 24 which imparts a heat, substantially uniform in quantity of heat in a plane of the substrate, to the substrate having been conveyed to the second room to heat the substrate; and a local heating part 23 which imparts a locally large quantity of heat to the substrate being carried from the first room to the second room.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT
机译:解决的问题:在短时间内有效地提高要在真空下处理的片状基板的温度并进一步抑制能量消耗。解决方案:本发明涉及一种加热片状基板的加热装置1。待在真空下处理的S,其包括:腔室11、21,其具有能够存储基板的第一室SP1和第二室SP2;第一百叶窗,该百叶窗打开和关闭第一房间与外部空间之间的接触;第二百叶窗S2使第一房间和第二房间彼此打开和关闭。第一减压部14、15,其减压第一室中的压力。第二减压部分25、26和27用于降低第二房间中的压力。运送机构12、22,其将基板从减压的第一室运送至减压的第二室。均匀加热部24,该均匀加热部24对已经被输送到第二室以加热基板的基板赋予在基板平面内的热量基本均匀的热量。局部加热部分23将局部大量的热量传递给从第一房间传送到第二房间的基板。选图:图1;版权:(C)2019,JPO&INPIT

著录项

  • 公开/公告号JP2019039058A

    专利类型

  • 公开/公告日2019-03-14

    原文格式PDF

  • 申请/专利权人 SCREEN HOLDINGS CO LTD;

    申请/专利号JP20170164000

  • 发明设计人 堀越 章;中島 直人;安澤 均;

    申请日2017-08-29

  • 分类号C23C14/34;

  • 国家 JP

  • 入库时间 2022-08-21 12:24:43

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