PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a high heat-resistant resin cured product that is preferable as an electronic component such as a semiconductor package and a semiconductor device, and an electronic component and a semiconductor device using the same.;SOLUTION: A composition for high heat-resistant resin cured product containing an epoxy resin and a polymerization catalyst type curing agent contains (a) a bisphenol A type epoxy resin and (b) a naphthalene type epoxy resin as epoxy resins, and contains (c) an imidazole type curing catalyst as a polymerization catalyst type curing agent. It is desirable to blend 5 mass% to 30 mass% of (b) the naphthalene type epoxy resin to the total amount of (a) the bisphenol A type epoxy resin and (b) the naphthalene type epoxy resin, and it is desirable that viscosity at 25°C is 100,000 (Pa s/25°C) or less.;SELECTED DRAWING: Figure 5;COPYRIGHT: (C)2019,JPO&INPIT
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机译：解决的问题：提供一种能够获得高耐热性的树脂固化物的树脂组合物，该树脂组合物优选用作电子组件，例如半导体封装和半导体器件，以及使用该树脂组合物的电子组件和半导体器件。 ;解决方案：包含环氧树脂和聚合催化剂型固化剂的高耐热性树脂固化产品用组合物，包含（a）双酚A型环氧树脂和（b）萘型环氧树脂作为环氧树脂，并且包含（ c）咪唑型固化催化剂作为聚合催化剂型固化剂。相对于（a）双酚A型环氧树脂和（b）萘型环氧树脂的总量，优选混合5质量％〜30质量％的（b）萘系环氧树脂。 25°C时的粘度不超过100,000（Pa s / 25°C）.;部分图纸：图5;版权：（C）2019，JPO＆INPIT
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