首页> 外国专利> MANUFACTURING METHOD OF CERAMIC-METAL JUNCTION BODY, MANUFACTURING METHOD OF MULTI-PIECE CERAMIC-METAL JUNCTION BODY, CERAMIC-METAL JUNCTION BODY AND MULTI-PIECE CERAMIC-METAL JUNCTION BODY

MANUFACTURING METHOD OF CERAMIC-METAL JUNCTION BODY, MANUFACTURING METHOD OF MULTI-PIECE CERAMIC-METAL JUNCTION BODY, CERAMIC-METAL JUNCTION BODY AND MULTI-PIECE CERAMIC-METAL JUNCTION BODY

机译：陶瓷接合体的制造方法，多块陶瓷接合体的制造方法，陶瓷接合体和多块陶瓷接合体的制造

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摘要

To restrain occurrence of blot formed on the surface of a metal layer joined to the surface of a ceramic substrate.SOLUTION: A manufacturing method of ceramic-metal junction body where a metal layer is joined to at least one face of a ceramic substrate has a groove formation step of forming a groove extending to traverse a junction region of the ceramic substrate to which the metal layer is joined, and a junction step of laminating a metal plate having thickness of 0.4 mm or less, composed of aluminum or an aluminum alloy, in the junction region of the ceramic substrate via an Al-Si-based brazing material foil, after the groove formation step, joining the metal plate to the junction region by heating while loading in the lamination direction, thus forming a metal layer.SELECTED DRAWING: Figure 2

机译：为了抑制在与陶瓷基板的表面接合的金属层的表面上形成污点。解决方案：一种将金属层接合至陶瓷基板的至少一个面上的陶瓷-金属接合体的制造方法具有如下特征：形成沟槽的步骤，该沟槽形成步骤，该沟槽延伸以横越接合有金属层的陶瓷基板的接合区域，并且接合步骤是层压由铝或铝合金构成的厚度为0.4mm或更小的金属板，在形成槽的步骤之后，经由Al-Si基钎料箔在陶瓷基板的接合区域中，在沿层叠方向加载的同时通过加热将金属板接合至接合区域，从而形成金属层。：图2

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公开/公告号JP2019186354A

专利类型
公开/公告日2019-10-24

原文格式PDF
申请/专利权人 MITSUBISHI MATERIALS CORP;
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申请/专利号JP20180074477
发明设计人 ARAI KOYA;KOMAZAKI MASAHITO;
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申请日2018-04-09
分类号H05K1/02;H05K3;H01L23/12;C04B37/02;
国家 JP
入库时间 2022-08-21 12:24:57

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