首页> 外国专利> ELECTRICALLY CONDUCTING THERMALLY CONDUCTIVE POLYMER RESIN COMPOSITION BASED ON STYRENICS WITH BALANCED PROPERTIES

ELECTRICALLY CONDUCTING THERMALLY CONDUCTIVE POLYMER RESIN COMPOSITION BASED ON STYRENICS WITH BALANCED PROPERTIES

机译:基于具有平衡特性的苯乙烯的导电导热高分子树脂组合物

摘要

Thermally conductive polymer (TCP) resin compositions are described, comprising: 50 to 75% matrix polymer (I) comprising styrenic polymers (F) such as ABS (acrylonitrile-butadiene-styrene) resins, ASA (acrylonitrile-styrene-acrylate) resins and elastomeric block copolymers of the structure (S-(B/S))n-S; and 25 to 50% thermally conductive filler material (II) (D50 0.1 to 200 μm), consisting of carbonyl iron powder (II-1) in mixture with multi wall carbon nanotubes, silicon carbide, diamond, graphite, aluminosilicates and/or boron nitride (II-2); wherein the volume ratio of (II-1)/(II-2) is 15:1 to 0.1:1. Shaped articles made thereof can be used for materials with antistatic finish, electrical and electronic housings, toys and helmet inlays.
机译:描述了导热聚合物(TCP)树脂组合物,其包含:50-75%的基体聚合物(I),其包含苯乙烯类聚合物(F),例如ABS(丙烯腈-丁二烯-苯乙烯)树脂,ASA(丙烯腈-苯乙烯-丙烯酸酯)树脂和(S-(B / S))nS结构的弹性嵌段共聚物; 25至50%的导热填充材料(II)(D50为0.1至200μm),由羰基铁粉(II-1)与多壁碳纳米管,碳化硅,金刚石,石墨,硅铝酸盐和/或硼混合而成氮化物(II-2);其中(II-1)/(II-2)的体积比为15:1至0.1:1。由其制成的成型制品可用于具有抗静电涂层的材料,电气和电子外壳,玩具和头盔嵌体。

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