APPARATUS AND METHODS FOR PREDICTING A SEMICONDUCTOR PARAMETER ACROSS AN AREA OF THE WAFER

• 1. 检查缺陷的方法、进行缺陷检查后的晶圆或者使用该晶圆制造的半导体元件、晶圆或者半导体元件的质量管理方法以及缺陷检查装置 [P] . 中国专利： CN102648405A . 2012-08-22
• 2. SiC外延晶圆、SiC外延晶圆的制造装置、SiC外延晶圆的制造方法及半导体装置 [P] . 中国专利： CN108028186A . 2018-05-11
• 3. APPARATUS AND METHODS FOR PREDICTING A SEMICONDUCTOR PARAMETER ACROSS AN AREA OF A WAFER [P] . 韩国专利： KR101381304B1 . 2014-04-04

  机译： 沿晶片区域预测半导体参数的装置和方法

• 4. Apparatus and methods for predicting a semiconductor parameter across an area of a wafer [P] . IL204014A . 2013-08-29

  机译： 用于在晶片的整个区域上预测半导体参数的设备和方法

• 5. APPARATUS AND METHODS FOR PREDICTING A SEMICONDUCTOR PARAMETER ACROSS AN AREA OF A WAFER [P] . 欧洲知识产权局专利： EP2188832A4 . 2012-10-17

  机译： 沿晶片区域预测半导体参数的装置和方法

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• 2. Heuristic tabu search scheduling algorithm for wet-etching systems in semiconductor wafer fabrications [J] . Zhou Binghai, Li Xin 高技术通讯（英文版） . 2013,第002期
• 3. METHOD AND APPARATUS FOR CLASSIFYING SEMICONDUCTOR WAFERS [J] . Research Disclosure . 2020,第677期
• 4. A practical method for predicting gold-wire deformation in transfer molding process of semiconductor devices. Part III: formulation of common parameters applicable to a BGA package and a QFP [J] . Saeki Junichi, Yoshida Isamu, Houzouji Hiroshi 成形加工: プラスチツク成形加工学会志 . 2001,第1期
• 5. A practical method for predicting gold-wire deformation in transfer molding process of semiconductor devices. Part III: formulation of common parameters applicable to a BGA package and a QFP [J] . Saeki Junichi, Yoshida Isamu, Houzouji Hiroshi 成形加工: プラスチツク成形加工学会志 . 2001,第1期
• 6. Chemical Mechanical Polishing of Semiconductor Wafers: Surface Element Modeling and Simulation To Predict Wafer Surface Shape [C] . Qi Zhang, Zhen Li, Houjun Qi, China Semiconductor Technology International Conference . 2021
• 7. Chemical Mechanical Polishing of Semiconductor Wafers: Surface Element Modeling and Simulation to Predict Wafer Surface Shape [D] . Wilson, Kenneth DeWayne, Jr. 2019
• 8. Regression models for predicting physical and EQD2 plan parameters of two methods of hybrid planning for stage III NSCLC [O] . Hao Wang, Yongkang Zhou, Wutian Gan, 2021
• 9. Development of a Whole-Wafer, Macroscale Inspection Software Method for Semiconductor Wafer Analysis [O] . Tobin, K.W. 2003
• 10. Method and Apparatus for Obtaining a Precision Thickness in Semiconductor and Other Wafers [R] . 2002

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• 2. A THEORETIC METHOD TO PREDICT POLYMER SOLUBILITY PARAMETERS [J] . Qing Ji Bao-fu Qiao De-lu Zhao . 高分子科学：英文版 . 2007,第2期
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• 5. 基于问题分解与蚁群算法的半导体晶圆制造系统调度方法的研究 [A] . 郭乘涛 . 2012