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ELECTRONIC CHIP PROVIDED WITH A PHASE CHANGE MATERIAL PROTECTION DEVICE, A METHOD OF DETECTING A CHIP ATTACK, AND A METHOD OF MANUFACTURING THE CHIP.
ELECTRONIC CHIP PROVIDED WITH A PHASE CHANGE MATERIAL PROTECTION DEVICE, A METHOD OF DETECTING A CHIP ATTACK, AND A METHOD OF MANUFACTURING THE CHIP.
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机译：一种具有相变材料保护装置的电子芯片，一种检测芯片攻击的方法以及一种制造芯片的方法。
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摘要
An electronic chip including an integrated circuit arranged a face of a substrate, and a protection device arranged partially facing the integrated circuit is provided. The protection device includes a capacitor having a first electrode and a second electrode between which a layer of phase change material is disposed changing locally from a first resistive state to a second resistive state different from the first state by penetration of a beam. The first state is an amorphous state wherein the capacitor has a first capacitance and/or a first resistance and the second state is a crystalline state wherein the capacitor has a second capacitance and/or a second resistance different from the first capacitance and first resistance. The protection device is electrically connected to the integrated circuit by at least one of the first or second electrodes so that the integrated circuit measures the resistance and/or capacitance of the capacitor.
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