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Arrangement with a power semiconductor module, with a DC voltage busbar and with a capacitor device

机译:功率半导体模块,直流电压母线和电容器设备的布置

摘要

Arrangement (1) with a power semiconductor module (2), with a capacitor device (3), with a DC voltage busbar (4) and with a connecting device (5), wherein the power semiconductor module (2) first and second flat formed DC voltage connection conductors (20, 22) respectively with a contact section (200, 220), wherein the DC voltage connection conductors (20, 22) are arranged close to each other at least in the region at and near the respective contact sections (200, 220) in the direction of their respective normal vector, wherein the capacitor device (3) first and second capacitive capacitor terminal conductors (30, 32) each having a contact portion (300, 320), the DC voltage bus (4) having first and second sub-rails (40, 42) each having a contact portion, and wherein the connection means (5) is a Yoke (52) with a plunger (520) and an associated abutment (50), w obei the respective contact portions (200, 220) of the DC voltage connection conductor (20, 22) with the circuitally associated contact portions (300, 320) of the capacitor device (3), at least closely adjacent at least in the area at and near the respective contact portions in the direction of their respective normal vector are formed to each other in the normal direction flat superimposed between the plunger (520) and the abutment (50) clamped and thus non-positively electrically connected to each other and wherein the DC voltage busbar (4) first and second sub-rails (40, 42) in the area are formed adjacent to each other near the respective contact sections in the direction of their respective normal vector, and whose respective contact sections are connected to the associated DC terminal by means of the yoke (52) with the associated fastening sections (26, 28), which thus form further contact sections (260, 280) ngsanschlussleiter (20, 22) are non-positively connected and electrically conductive.
机译:具有功率半导体模块(2),电容器装置(3),直流电压母线(4)和连接装置(5)的装置(1),其中功率半导体模块(2)第一和第二扁平形成分别具有接触部分(200、220)的DC电压连接导体(20、22),其中DC电压连接导体(20、22)至少在各个接触部分处和附近的区域中彼此靠近布置。 (200、220)沿其各自法向矢量的方向,其中电容器设备(3)的第一和第二电容性电容器端子导体(30、32)每个都具有接触部分(300、320),直流电压总线(4 )具有分别具有接触部分的第一和第二子导轨(40、42),并且其中连接装置(5)是具有柱塞(520)和相关的支座(50)的轭架(52),直流电压连接导体(20、22)的相应接触部分(200、220)与电路相关电容器装置(3)的接触部(300、320)至少在其各自的法线矢量方向上至少在各个接触部处及其附近的区域中彼此紧密相邻,并且在法线方向上彼此平坦地重叠形成。在柱塞(520)和基台(50)之间被夹紧并因此彼此形锁合地电连接,并且其中该区域中的直流电压母线(4)的第一和第二子导轨(40、42)与沿各自法线矢量的方向在各个接触部分之间彼此靠近,并且其各个接触部分通过轭(52)与相关的紧固部分(26、28)连接到相关的DC端子。另外的接触部分(260、280)非刚性连接并且导电。

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