首页>
外国专利>
A PRETREATING-ACTIVATING SOLUTION FOR AN ELECTROLESS NICKEL PLATING A METHOD FOR ELECTROLESS PLATING A THIN-NICKEL AND A METHOD FOR SURFACE-TREATING USING THE SAME AND A PRINTED CIRCUIT BOARD COMPRISING AN ELECTROLESS THIN-NICKEL
A PRETREATING-ACTIVATING SOLUTION FOR AN ELECTROLESS NICKEL PLATING A METHOD FOR ELECTROLESS PLATING A THIN-NICKEL AND A METHOD FOR SURFACE-TREATING USING THE SAME AND A PRINTED CIRCUIT BOARD COMPRISING AN ELECTROLESS THIN-NICKEL
According to the present invention, there is provided a pretreating-activating solution for electroless nickel plating including a palladium compound, ammonium salt, a pH adjuster, a copper ion elution inhibitor, and an EO/PO copolymer represented by the following formula (1) as a stabilizer, an ultra-thin electroless Ni plating method using the same, resultant ultra-thin electroless Ni plating, and a printed circuit board including the same. The ultra-thin electroless Ni plating manufactured through an improved Thin-ENEPIG process according to the present invention and the printed circuit board including the same (1) has no void or erosion at the interface between a copper surface and the ultra-thin electroless Ni plating (Thin-Ni), (2) has a reduced stress because it has the form of an amorphous soft Ni plating film, (3) has no circuit spread in the microcircuit, (4) has no surface defect such as pinholes and skip plating in the surface of the final microcircuit (Au plated layer), (5) is highly reliable and excellent in performance and physical properties such as solderability, wire bonding properties, surface uniformity, and corrosion resistance, and (6) addresses problems of the related art by means of a total Ni/Pd/Au plating thickness of 0.5 to 0.7 micrometers, and thus (7) can be utilized in manufacturing a printed circuit board having a very fine pattern with a line/space of 20 to 10 micrometers/20 to 10 micrometers and an ultra fine pattern with a line/space of 10 micrometers/10 micrometers or less.
展开▼
