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HIGHLY HEAT CONDUCTIVE FILM-SHAPED ADHESIVE COMPOSITION HIGHLY HEAT CONDUCTIVE FILM-SHAPED ADHESIVE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE BY USING THE HIGHLY HEAT CONDUCTIVE FILM-SHAPED ADHESIVE
HIGHLY HEAT CONDUCTIVE FILM-SHAPED ADHESIVE COMPOSITION HIGHLY HEAT CONDUCTIVE FILM-SHAPED ADHESIVE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE BY USING THE HIGHLY HEAT CONDUCTIVE FILM-SHAPED ADHESIVE
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机译：高导热膜状胶粘剂组合物高导热膜状胶粘剂和使用高导热膜状胶粘剂生产半导体包装的方法
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摘要
A composition for a high thermal conductive film-like adhesive capable of obtaining a high thermal conductive film-like adhesive excellent in adhesion to an object to be arrived, having a sufficiently low rate of abrasion of a processing blade and exhibiting excellent thermal conductivity after curing, A semiconductor package using the same, and a manufacturing method thereof. (A), an epoxy resin curing agent (B), an inorganic filler (C) and a phenoxy resin (D), wherein the inorganic filler (C) (I) an average particle diameter of 0.1 to 5.0 mu m, (Ii) Mohs hardness of 1 to 8, (Iii) the thermal conductivity satisfies the overall condition of 30 W / (mK) or more, and Wherein the content of the inorganic filler (C) is 30 to 70% by volume.
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