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METHOD FOR MANUFACTURING BY-DIRECTIONAL ELECTRICALLY CONDUCTIVE MODULE USING ULTRA-PRECISION MACHINING TECHNOLOGY AND METHOD FOR MANUFACTURING BY-DIRECTIONAL ELECTRICALLY CONDUCTIVE TEST MODULE USING THE SAME
METHOD FOR MANUFACTURING BY-DIRECTIONAL ELECTRICALLY CONDUCTIVE MODULE USING ULTRA-PRECISION MACHINING TECHNOLOGY AND METHOD FOR MANUFACTURING BY-DIRECTIONAL ELECTRICALLY CONDUCTIVE TEST MODULE USING THE SAME
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机译：使用超精密加工技术制造定向导电模块的方法和使用该方法制造定向导电测试模块的方法
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摘要
The present invention relates to a method to manufacture a bidirectional conductive module applicable to a test of a semiconductor device with various pitches and a bidirectional conductive test module manufacturing method using the same. According to one embodiment of the present invention, the method comprises: (a) a step of manufacturing a base module in which a plurality of conductive wires having conductivity are horizontally arranged by being spaced apart from each other at fine intervals; and (b) a step of forming an insulating main body with an insulating material having elasticity in order to allow each conductive wire to be received therein while upper and lower areas of each conductive wire are exposed to upper and lower parts, respectively. Accordingly, the bidirectional conductive module can be applied to a semiconductor device with various pitches while supplementing a disadvantage of a pogo-pin type semiconductor test socket.
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