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COMPOSITION FOR FORMING RESIST LOWER LAYER FILM FOR SEMICONDUCTOR RESIST LOWER LAYER FILM PROCESS FOR FORMING RESIST LOWER LAYER FILM AND PROCESS FOR PRODUCING PATTERNED SUBSTRATE
COMPOSITION FOR FORMING RESIST LOWER LAYER FILM FOR SEMICONDUCTOR RESIST LOWER LAYER FILM PROCESS FOR FORMING RESIST LOWER LAYER FILM AND PROCESS FOR PRODUCING PATTERNED SUBSTRATE
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机译:半导体低阻膜的形成低阻膜的组合物,低阻膜的形成低电阻膜的过程及制造图案化基材的方法
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摘要
The purpose of the present invention is to provide a resist lower layer film forming composition for a semiconductor, which is capable of forming a resist lower layer film that is not only excellent in flatness, embeddability and solvent resistance, but also is excellent in defect inhibitory performance after etching; the resist lower layer film; a method of forming the resist lower layer film; and a method of manufacturing a patterned substrate. The resist lower layer film forming composition of the present invention is a semiconductor resist lower layer film forming composition for forming the resist lower layer film stacked on the patterned substrate, and contains a solvent and a compound with an aromatic ring, wherein the solvent comprises a first solvent having a standard boiling point of less than 156°C and a second solvent having a standard boiling point of 156°C to less than 300°C. The second solvent has a preferable standard boiling point of 200°C or higher. The first solvent preferably includes alkylene glycol monoalkyl ethers, alkylene glycol monoalkylether acetates, or combinations thereof.
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