首页> 外国专利> COMPOSITION FOR FORMING RESIST LOWER LAYER FILM FOR SEMICONDUCTOR RESIST LOWER LAYER FILM PROCESS FOR FORMING RESIST LOWER LAYER FILM AND PROCESS FOR PRODUCING PATTERNED SUBSTRATE

COMPOSITION FOR FORMING RESIST LOWER LAYER FILM FOR SEMICONDUCTOR RESIST LOWER LAYER FILM PROCESS FOR FORMING RESIST LOWER LAYER FILM AND PROCESS FOR PRODUCING PATTERNED SUBSTRATE

机译:半导体低阻膜的形成低阻膜的组合物,低阻膜的形成低电阻膜的过程及制造图案化基材的方法

摘要

The purpose of the present invention is to provide a resist lower layer film forming composition for a semiconductor, which is capable of forming a resist lower layer film that is not only excellent in flatness, embeddability and solvent resistance, but also is excellent in defect inhibitory performance after etching; the resist lower layer film; a method of forming the resist lower layer film; and a method of manufacturing a patterned substrate. The resist lower layer film forming composition of the present invention is a semiconductor resist lower layer film forming composition for forming the resist lower layer film stacked on the patterned substrate, and contains a solvent and a compound with an aromatic ring, wherein the solvent comprises a first solvent having a standard boiling point of less than 156°C and a second solvent having a standard boiling point of 156°C to less than 300°C. The second solvent has a preferable standard boiling point of 200°C or higher. The first solvent preferably includes alkylene glycol monoalkyl ethers, alkylene glycol monoalkylether acetates, or combinations thereof.
机译:本发明的目的是提供一种用于半导体的抗蚀剂下层膜形成用组合物,该组合物能够形成不仅平坦性,嵌入性和耐溶剂性优异,而且缺陷抑制性也优异的抗蚀剂下层膜。蚀刻后的性能;抗蚀剂下层膜;形成抗蚀剂下层膜的方法;以及制造图案化基板的方法。本发明的抗蚀剂下层膜形成用组合物是用于形成层叠在图案化基板上的抗蚀剂下层膜的半导体抗蚀剂下层膜形成用组合物,其包含溶剂和具有芳香环的化合物,其中,所述溶剂包含第一溶剂的标准沸点小于156℃,第二溶剂的标准沸点为156℃至小于300℃。第二溶剂的标准沸点优选为200℃以上。第一溶剂优选包括亚烷基二醇单烷基醚,亚烷基二醇单烷基醚乙酸酯或其组合。

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