首页> 外国专利> PLATING APPARATUS SUBSTRATE HOLDER CONTROL METHOD FOR PLATING APPARATUS AND STORAGE MEDIUM STORING A PROGRAM FOR CAUSING A COMPUTER TO EXECUTE A METHOD FOR CONTROLLING A PLATING APPARATUS

PLATING APPARATUS SUBSTRATE HOLDER CONTROL METHOD FOR PLATING APPARATUS AND STORAGE MEDIUM STORING A PROGRAM FOR CAUSING A COMPUTER TO EXECUTE A METHOD FOR CONTROLLING A PLATING APPARATUS

机译:用于放置设备和存储介质的放置设备的基板保持器控制方法,用于存储引起计算机执行的程序的方法,用于控制放置设备的方法

摘要

The present invention relates to a plating apparatus to plate a substrate using a substrate holder having an elastic protrusion portion sealing a surface to be plated of the substrate, comprising: a measuring apparatus to measure at least one of an amount of push of the elastic protrusion portion and a load applied to the elastic protrusion portion when the substrate is physically in contact with the elastic protrusion portion of the substrate holder, and measuring a deformation state of the elastic protrusion portion; and a control apparatus to determine whether the sealing performed by the elastic protrusion portion is in a normal state based on the measured deformation state.
机译:电镀装置技术领域本发明涉及一种电镀装置,该电镀装置使用具有将弹性的突出部密封基板的被镀面的基板保持架来对基板进行电镀的电镀装置,其包括:测量装置,其对弹性突起的推压量中的至少一个进行测定。当基板与基板保持器的弹性突出部物理接触时,测量弹性突出部的变形状态,并测量该弹性突出部的变形状态。控制装置,其基于所测量的变形状态来确定由弹性突出部执行的密封是否处于正常状态。

著录项

  • 公开/公告号KR20170137613A

    专利类型

  • 公开/公告日2017-12-13

    原文格式PDF

  • 申请/专利权人 EBARA CORPORATION;

    申请/专利号KR20170045086

  • 发明设计人 FUJIKATA JUMPEI;

    申请日2017-04-07

  • 分类号C25D17;C25D17/06;C25D21/12;H01L21/288;

  • 国家 KR

  • 入库时间 2022-08-21 12:41:49

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