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MANUFACTURING METHOD OF FLEXIBLE CUPPER CLAD LAMINATED FILM FOR SEMI-ADDITIVE CONTAINING ULTRATHIN POLYIMIDE FILM AND ITS FLEXIBLE CUPPER CLAD LAMINATED FILM FOR SEMI-ADDITIVE
MANUFACTURING METHOD OF FLEXIBLE CUPPER CLAD LAMINATED FILM FOR SEMI-ADDITIVE CONTAINING ULTRATHIN POLYIMIDE FILM AND ITS FLEXIBLE CUPPER CLAD LAMINATED FILM FOR SEMI-ADDITIVE
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机译：含超薄聚酰亚胺薄膜的柔性覆铜箔层合膜的制备方法及其半覆膜柔性覆铜箔层合膜
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摘要
The present invention relates to a method for manufacturing a flexible cupper thin film for a semi-additive containing an ultrathin polyimide film and to a flexible cupper thin film laminated film for a semi-additive manufactured therefrom. In the present invention, when performing sputtering and electroplating processes at a high temperature by attaching an adhesive protective film to the back surface of the ultrathin polyimide film, during a process for manufacturing a flexible cupper thin film laminated film for a semi-additive using sputtering and electroplating, problems in processes such as thermal shock, folding of the film, wrinkles, and the like are solved by the adhesive protective film, and thus it is possible to process a semi-additive flexible copper thin film laminated film to which an ultrathin polyimide film having a thickness of 20 m or less is applied.
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