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SEMICONDUCTOR REFRIGERATION DEVICE WITH MULTIPLE TEMPERATURE AREAS
SEMICONDUCTOR REFRIGERATION DEVICE WITH MULTIPLE TEMPERATURE AREAS
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机译：具有多个温度区域的半导体制冷装置
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摘要
Disclosed is a semiconductor refrigeration device with multiple temperature areas, comprising a box housing (200) and multiple liners (100) provided in the box housing (200), wherein two adjacent liners (100) are connected via a thermally insulated connection member (101), and each liner (100) forms a refrigeration compartment, and characterised in that each liner (100) is fitted with a semiconductor refrigeration module, the semiconductor refrigeration module comprising a semiconductor refrigeration chip (1), a hot end heat radiator and a cold end heat radiator assembled together, wherein the cold end heat radiator is provided on the liner (100), the hot end heat radiator is provided on a back plate of the box housing (200), two adjacent hot end heat radiators are spaced apart via an air guide plate (300), the air guide plate (300) divides the back plate into multiple separate heat dispersion areas, and each heat dispersion area is provided with a heat-dispersing fan (400). The refrigeration device can increase the refrigeration efficiency of the refrigeration device and reduce energy consumption.
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