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Method for manufacturing a HEMT transistor and HEMT transistor with improved electron mobility

机译:制造HEMT晶体管的方法和具有改善的电子迁移率的HEMT晶体管

摘要

A method for manufacturing a HEMT transistor comprising the steps of: providing a wafer comprising a semiconductor body including a heterojunction structure formed by semiconductor materials that include elements of Groups III-V of the Periodic Table, and a dielectric layer on the semiconductor body; etching selective portions of the wafer, thus exposing a portion of the heterojunction structure; forming an interface layer by a surface reconstruction process, of a semiconductor compound formed by elements of Groups III-V of the Periodic Table, in the exposed portion of the heterojunction structure; and forming a gate electrode, including a gate dielectric and a gate conductive region, on said interface layer.
机译:一种用于制造HEMT晶体管的方法,包括以下步骤:提供晶片,该晶片包括:半导体本体,该半导体本体包括由包含周期表的III-V族元素的半导体材料形成的异质结结构;以及在该半导体本体上的介电层;蚀刻晶片的选择性部分,从而暴露异质结结构的一部分;通过表面重构工艺,在异质结结构的暴露部分中形成由元素周期表的III-V族元素形成的半导体化合物的界面层;在所述界面层上形成包括栅介质和栅导电区的栅电极。

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