首页> 外国专利> Sensor chip for SPFS measurement, SPFS measurement method using sensor chip for SPFS measurement, and SPFS measurement device equipped with sensor chip for SPFS measurement

Sensor chip for SPFS measurement, SPFS measurement method using sensor chip for SPFS measurement, and SPFS measurement device equipped with sensor chip for SPFS measurement

机译:用于SPFS测量的传感器芯片,使用该传感器芯片进行SPFS测量的SPFS测量方法以及配备有用于SPFS测量的传感器芯片的SPFS测量设备

摘要

[Problem] To provide a sensor chip for SPFS measurement, by which, irrespective of environmental conditions, fluctuations are low in characteristics such as signal, noise, or detection sensitivity, quantitative property can be ensured, and a highly precise and accurate SPFS measurement can be carried out. [Solution] A sensor chip for SPFS measurement which has a dielectric member having been produced by carrying out injection molding of a resin, when viewing from the metal thin film-formed surface side of the dielectric member and taking as b the distance of the side end surface position of the resin inlet to the position on the metal thin film-formed surface that is farthest from the side end surface position of the resin inlet, the center of a ligand immobilization part is located in the area between the 3b/8 position and the 6b/8 position from the side end surface position of the resin inlet.
机译:[问题]为了提供一种用于SPFS测量的传感器芯片,通过该传感器芯片,无论环境条件如何,信号,噪声或检测灵敏度等特性的波动都较小,可以确保定量特性,并且可以进行高精度且高精度的SPFS测量。被执行。 [解决方案]当从介电构件的形成金属薄膜的表面侧观察时,将通过进行树脂的注射成型而制造的介电构件制成的用于SPFS测量的传感器芯片作为侧面。树脂入口的端面位置相对于距树脂入口的侧面端面位置最远的金属薄膜形成面的位置,配体固定部的中心位于3b / 8位置之间的区域。从树脂入口的侧端面位置起6b / 8位置。

著录项

  • 公开/公告号US9970875B2

    专利类型

  • 公开/公告日2018-05-15

    原文格式PDF

  • 申请/专利权人 KONICA MINOLTA INC.;

    申请/专利号US201214367323

  • 发明设计人 MASATAKA MATSUO;KENJI ISHIDA;

    申请日2012-12-25

  • 分类号G01N33/551;G01N21/64;G01N33/543;

  • 国家 US

  • 入库时间 2022-08-21 12:59:46

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