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A process for the preparation of a scintillator - detector array of a detector module of a radiation detector, scintillator - detector array detector module, and a radiation detector
A process for the preparation of a scintillator - detector array of a detector module of a radiation detector, scintillator - detector array detector module, and a radiation detector
A process for the preparation of a scintillator - detector array of a detector module (2) a radiation detector (1), comprising a first layer of a photodiodes electronics substrate (8) with a large number of conductor elements to an electronic evaluation system (9), connected with a second photodiode layer (6) consists of a photodiode array with photodiodes and a photo diodes electronics (6.1), in turn connected with a third scintillator layer (4) for the conversion of x-rays into light that can be detected by the photodiodes, comprising the following process steps:1.1. Generating a first sandwich from the photodiodes electronics substrate (8) and the photodiode layer (6) by generating a plurality of electrically conducting connections between the photo diodes electronics and the respective spatially associated read-out electronics (9) of the photo diodes electronics substrate (8), wherein a first filling gap (7) is produced,1.2. The introduction of a first adhesive variant (kA) below a predetermined first temperature profile by a capillary filling process in the first filling gap (7) between the first and second layer (8, 6), wherein1.2.1. for the introduction of the first adhesive variant (kA) a storage container (10) with capillary nozzle (10.1) is used, which has an adhesive supply, which is greater than the directly in the case of filling with adhesive quantity of adhesive used,the adhesive supply 1.2.2. by joining a capillary opening of the capillary (10.1) of the storage container (10) with the filling volume between the layers (8, 6) only partially into the filling volume is sucked in which, however, the filling volume is completely filled, and1.2.3. the connection between the capillary (10.1) of the storage container (10) and the filling volume of at least over a part of a to the filling following curing time in order to compensate for adhesive shrinkage in the filling volume remains,1.3. Generating a second sandwiches (8, 6; 4) from the first sandwich (8, 6) and disposed above the scintillator layer (4) by means of first partial connection of the first sandwiches (8, 6) with the scintillator layer (4), wherein a second filling gap (5) is produced, and1.4. The introduction of a second optically continuous adhesive variant (kB) by a capillary filling process between the first sandwich (8, 6) and the third scintillator layer (4), wherein1.5. the predefined first temperature profile runs as follows: ..
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机译：一种用于制备闪烁体的方法-探测器模块的探测器阵列（2）辐射探测器（1），包括第一层光电二极管电子基板（8），该电子二极管电子基板具有大量电子元件到电子评估系统（ 9）与第二光电二极管层（6）相连，该光电二极管层由带有光电二极管的光电二极管阵列和光电二极管电子器件（6.1）组成，依次与第三闪烁体层（4）连接，用于将X射线转换为可以由光电二极管检测，包括以下处理步骤：1.1。通过在光电二极管电子器件与光电二极管电子器件衬底的各个空间相关联的读出电子器件（9）之间产生多个导电连接，从光电二极管电子器件衬底（8）和光电二极管层（6）产生第一三明治。 （8），其中产生第一填充间隙（7），1.2。在第一和第二层（8、6）之间的第一填充间隙（7）中，通过毛细管填充工艺将低于预定的第一温度曲线的第一粘合剂变体（k A ）引入，其中.2.1。为了引入第一种粘合剂变型（k A ），使用了带有毛细管喷嘴（10.1）的存储容器（10），该容器的粘合剂供应量比直接使用时要大。用粘合剂填充粘合剂用量，粘合剂供应1.2.2。通过将储存容器（10）的毛细管（10.1）的毛细管开口与各层（8、6）之间的填充容积接合，仅部分地吸入该填充容积中，然而，该填充容积被完全填充，和1.2.3。在固化时间之后，储存容器（10）的毛细管（10.1）与至少一部分填充空间之间的连接至填充物，以补偿填充空间中的粘合剂收缩，1.3。从第一夹层（8、6）产生第二夹层（8、6; 4），并通过第一夹层（8、6）与闪烁体层（4）的第一部分连接而布置在闪烁体层（4）上方。 ），其中产生第二填充间隙（5），以及1.4。通过在第一夹层（8、6）和第三闪烁体层（4）之间的毛细管填充工艺引入第二光学连续粘合剂变体（k B ），其中1.5。预定义的第一温度曲线运行如下：
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