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PLATING APPARATUS AND PLATING METHOD FOR ALLOY WITH EXOTHERMIC AND AMORPHOUS CHARACTERISTICS PLATING
PLATING APPARATUS AND PLATING METHOD FOR ALLOY WITH EXOTHERMIC AND AMORPHOUS CHARACTERISTICS PLATING
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机译：具有放热和非晶特征镀层的合金的镀层装置和镀层方法
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摘要
The present invention relates to a plating apparatus and a plating method for alloy plating, and the present invention includes a plating apparatus and a plating method for alloy plating.The present invention also provides a method for preparing a water based alloy plating solution comprising the steps of: preparing an aqueous alloy plating solution containing an acid, a base and an additive in a water-based plating solution; preparing a positive electrode and a negative electrode, wherein the positive electrode comprises a first metal element and a second metal element A step of preparing an electrode to be prepared with a mesh type anode, a step of immersing the anode and the cathode in the aqueous alloy plating solution to constitute an electrolytic plating circuit, and a step of controlling the electrolytic plating circuit to control the metal elements Applying a reduction potential or current to the positive electrode or the negative electrode by inputting a voltage between +2 V and-4.5 V or a corresponding current value on the basis of a standard hydrogen electrode at 25C according to the metal salt reduction potential, A step of forming at least two or more multilayered amorphous metal plating films on the negative electrode or the substrate by a standard reduction potential difference, It is about the law.According to the present invention, the concentration of the metal ions to be plated in the plating solution can be kept constant, and when the different materials are combined in multiple layers, the difference in metal ion concentration can be remarkably reduced in each plating section. As a result, the step of measuring the metal ion concentration during the plating, the step of adding the metal salt, and the like are omitted, and the manufacturing cost can be lowered. Further, since the concentration of metal ions to be plated in the plating solution is constantly controlled by using a timer switch or the like, the present invention can remarkably reduce the manufacturing cost. The present invention has the effect of continuing the plating of the multi-component alloy more uniformly and efficiently.In addition, the uniformity of the metal multilayer plating film can be formed by maintaining the metal ion concentration in the alloy plating solution at a constant level through the plating apparatus and the plating method for the alloy plating of the present invention, and the amorphous and heat-And has an effect of being used for low-temperature bonding by using heat generated from a phase change from amorphous to crystalline at low temperature through heating.;
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