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-PDMS METHOD FOR BONDING THERMOPLASTIC-PDMS SUBSTRATE FOR MANUFACTURING MICROFLUIDIC DEVICE

机译:于制造微流体装置的热塑性PDMS基体的-PDMS方法

摘要

Disclosed is a method for bonding a solventless thermoplastic-PDMS substrate for the fabrication of microfluidic devices. A thermoplastic-PDMS bonding method according to an embodiment of the present invention comprises the steps of: a) irradiating a thermoplastic substrate surface with UV until the water contact angle of the substrate surface is reduced to within a range of 30 to 40; B) vapor-depositing a silane coupling agent on the surface of the substrate irradiated with UV in a vacuum oven to coat the surface of the substrate with the silane coupling agent while preventing self-agglomeration of the silane coupling agent; C) subjecting the surface of the substrate coated with the silane coupling agent to corona discharge treatment; And d) forming a microchannel on at least one of the thermoplastic substrate and the PDMS substrate, subjecting the PDMS substrate to corona discharge treatment, and then pressing the PDMS substrate against the thermoplastic substrate at 60C and 0.1 MPa Bonding.;
机译:公开了一种粘合无溶剂热塑性PDMS基底以制造微流体装置的方法。根据本发明的实施方式的热塑性-PDMS粘合方法包括以下步骤:a)用UV照射热塑性基材表面,直到基材表面的水接触角减小到30至40的范围内; B)在真空烘箱中在用紫外线照射的基材表面上气相沉积硅烷偶联剂,以在硅烷表面不凝结的同时用硅烷偶联剂涂覆基材表面; C)对涂有硅烷偶联剂的基材表面进行电晕放电处理; d)在热塑性基材和PDMS基材中的至少一个上形成微通道,对PDMS基材进行电晕放电处理,然后在60℃和0.1MPa的粘结下将PDMS基材压在热塑性基材上。

著录项

  • 公开/公告号KR101741155B1

    专利类型

  • 公开/公告日2017-05-29

    原文格式PDF

  • 申请/专利权人 가천대학교 산학협력단;

    申请/专利号KR20150105684

  • 发明设计人 이내윤;

    申请日2015-07-27

  • 分类号B01L3/00;C08L101/00;C09J183/02;C23C16/22;

  • 国家 KR

  • 入库时间 2022-08-21 13:25:26

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