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MANUFACTURING TECHNOLOGY OF UNDERWATER LIGHT EMITTING DIODE (LED) LIGHTING DEVICE HAVING INTEGRATED HIGH BRIGHTNESS LED WATERPROOF PACKAGE LIGHT EMITTING DEVICE COMBINED WITH INTEGRATED ALUMINUM HEAT RADIATION PLATE LIGHTING DEVICE CASE
MANUFACTURING TECHNOLOGY OF UNDERWATER LIGHT EMITTING DIODE (LED) LIGHTING DEVICE HAVING INTEGRATED HIGH BRIGHTNESS LED WATERPROOF PACKAGE LIGHT EMITTING DEVICE COMBINED WITH INTEGRATED ALUMINUM HEAT RADIATION PLATE LIGHTING DEVICE CASE
The present invention relates to an underwater light emitting diode (LED) lighting device using a high brightness, high power LED device having a die chip integrated therein. The underwater LED lighting device of the present invention comprises: lighting modules for emitting light; a heat radiation unit mounted at a rear side of the lighting modules to dissipate heat generated from the lighting modules; a circuit board installed an upper portion of the heat radiation unit, having the lighting modules installed at regular intervals, and having a circuit for driving the lighting modules embedded therein; a diffusion lens plate installed at an upper portion of the circuit board, and accommodating the lighting modules to have a plurality of diffusion lenses arranged therein to diffuse light to the outside; and a waterproof member formed between the circuit board and the diffusion lens plate. According to the lighting modules of a fishing lamp using a high brightness and high power LED device having a die chip integrated therein of the present invention, a block having an LED die chip to be mounted therein is formed on a first printed circuit board (PCB), and Ag (silver) is applied on an opposite surface of the first PCB on which the LED die chip is seated, and then the first PCB is pressed and coupled to a second PCB. Also, conductive pads made of coppers (Cu) are alternately formed with each other on both sides of a surface of the first PCB, and then graphene is sprayed into the block. Furthermore, the LED die chip is arranged on an upper portion of the graphene to be cured, and at least one LED device separately connected to the conductive pads of both sides of the LED die chip in parallel with two wires is included.;COPYRIGHT KIPO 2017
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