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BASE FILM FOR DICING SHEET DICING SHEET INCLUDING SAID BASE FILM AND PROCESS FOR PRODUCING SAID BASE FILM

机译:切成薄片的基膜包括说成膜的切成薄片和生产说成膜的过程

摘要

The substrate film 2 of the dicing sheet comprises a cutting edge restraining layer A and an expanded layer B laminated on one main surface of the cutting edge suppressing layer A, B) has a laminated structure of a plurality of resin-based layered bodies, and the resin-based layered body (B1) disposed most proximal to the cutting-piece inhibiting layer (A) among the plurality of resin-based layered bodies comprises linear polyethylene as a main resin, The resin-based layered body (B2) of at least one resin-based layered body (B1) other than the resin-based layered body (B1) among the plurality of resin-based layered bodies comprises an ethylene- (meth) acrylic acid copolymer as a main resin, Containing resin (a1) which is a thermoplastic resin having at least one kind of a cyclic ring and an aliphatic ring and an acyclic olefinic resin (a2) which is an olefinic thermoplastic resin other than the ring-containing resin (a1). The substrate film 2 of such a dicing sheet is excellent in expandability and resilience.
机译:切割片的基材膜2包括:切削刃抑制层A和层叠在切削刃抑制层A的一个主表面上的扩展层B,B)具有多个树脂基层状体的层叠结构,并且在多个树脂基层状体中,最靠近切断片抑制层(A)配置的树脂基层状体(B1)以直链状的聚乙烯为主要树脂,树脂基层状体(B2)为树脂制。多个树脂基层状体中的树脂基层状体(B1)以外的至少一种树脂基层状体(B1)以乙烯-(甲基)丙烯酸共聚物为主要树脂,含有树脂(a1)。它是具有至少一种环和脂族环的热塑性树脂,以及一种非环烯烃树脂(a2),该无环烯烃树脂是除含环树脂(a1)以外的烯烃热塑性树脂。这种切割片的基材膜2的膨胀性和回弹性优异。

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