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UV A measurement method of UV light for in-line system using a semiconductor package manufacturing process
UV A measurement method of UV light for in-line system using a semiconductor package manufacturing process
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机译：UV一种使用半导体封装制造工艺的在线系统的紫外线测量方法
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摘要
The present invention discloses a method for measuring UV light in an in-line system, which enables to uniformly reduce adhesion of a surface protective tape in the in-line system for manufacturing a semiconductor package including back grinding facility. To this end, an in-line system for manufacturing a semiconductor package, which is installed with a UV light irradiation means on a sealed transfer path, is prepared, and a vacuum chuck is separated from a wafer transfer arm installed on the transfer path of the in-line system. An additional jig for measuring UV light, in which a wireless UV light sensor is mounted, is mounted on the wafer transfer arm to measure a UV light amount in the in-line system.
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