The present invention relates to a high-speed texturing system comprising: a substrate adsorption porous chuck on which a wafer is disposed; a transfer unit for transferring the substrate adsorption porous chuck; a wafer inspection device for scanning the surface of the wafer on the substrate adsorption porous chuck being transferred; a high-speed surface processing device for processing the scanned surface of the wafer by a laser and supplying a purge gas to remove a processing by-product; and a wafer cleaning device for cleaning the processed wafer.
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