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Substrate for printed electronics and photonic curing process

机译：印刷电子和光子固化工艺的基材

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摘要

A coating layer 12 is formed on a base film 10 by heat resistant resin having a Tg (glass transition temperature) of 120° C. or more, and more preferably 200° C. or more, and a functional thin film 14 is produced by printing ink composite including conductive particles on a surface of the coating layer 12 and thereby forming an ink layer. This functional thin film 14 is sintered by heating performed by photo irradiation, and a conductive layer is formed thereby.

机译：通过Tg（玻璃化转变温度）为120℃以上，更优选为200°的耐热树脂在基膜 10 上形成涂层 12 。 C.以上，并通过在涂层 12 的表面上印刷包括导电颗粒的油墨复合材料并由此形成油墨层来制造功能性薄膜 14 。该功能性薄膜 14 通过光照射进行的加热而烧结，从而形成导电层。 展开▼

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公开/公告号US9631283B2

专利类型

公开/公告日2017-04-25

原文格式PDF

申请/专利权人 SHOWA DENKO K.K.;
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申请/专利号US201314405662

发明设计人 KURT A. SCHRODER;HIROSHI UCHIDA;KENJI SHINOZAKI;
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申请日2013-05-31

分类号B32B3/02;C23C30;B41M3;H05K1/03;H05K3/12;H05K1/09;

国家 US

入库时间 2022-08-21 13:44:32

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