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Land grid array interconnect formed with discrete pads
Land grid array interconnect formed with discrete pads
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机译：用分立焊盘形成的焊盘栅格阵列互连
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摘要
A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.
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