首页> 外国专利> STACKED LAMINATE INDUCTORS FOR HIGH MODULE VOLUME UTILIZATION AND PERFORMANCE-COST-SIZE-PROCESSING-TIME TRADEOFF

STACKED LAMINATE INDUCTORS FOR HIGH MODULE VOLUME UTILIZATION AND PERFORMANCE-COST-SIZE-PROCESSING-TIME TRADEOFF

机译:叠层电感器,用于大批量生产和性能成本大小处理时间的权衡

摘要

Embodiments of electronic devices, such as integrated circuit (IC) packages are disclosed. In one embodiment, an electronic device includes a first substrate and a second substrate. The first substrate has a first substrate body and a first inductor portion integrated into the first substrate body. Additionally, the second substrate comprises a second substrate body and a second inductor portion integrated into the second substrate body. The second substrate is mounted on the first substrate such that such that the second inductor portion is positioned over the first inductor portion and such that the second inductor portion is electrically connected to the first inductor portion so that the first inductor portion and the second inductor portion form a three dimensional (3D) inductor. By using two substrates, the 3D inductor can be increased in height while still allowing the substrates to be miniaturized and standardized for an IC package.
机译:公开了诸如集成电路(IC)封装的电子设备的实施例。在一个实施例中,一种电子设备包括第一基板和第二基板。第一基板具有第一基板主体和集成到第一基板主体中的第一电感器部分。另外,第二基板包括第二基板主体和集成到第二基板主体中的第二电感器部分。将第二基板安装在第一基板上,使得第二电感器部分位于第一电感器部分上方,并且第二电感器部分电连接至第一电感器部分,从而第一电感器部分和第二电感器部分形成一个三维(3D)电感器。通过使用两个基板,可以增加3D电感器的高度,同时仍允许将基板微型化和标准化以用于IC封装。

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