Pd=P0/S ;where P0 and S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cm2 or less. The irradiation time t (μsec) satisfies; t≧10×d/Pd)1/2."/>
MANUFACTURING METHOD FOR GLASS SUBSTRATE, METHOD FOR FORMING HOLE IN GLASS SUBSTRATE, AND APPARATUS FOR FORMING HOLE IN GLASS SUBSTRATE
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MANUFACTURING METHOD FOR GLASS SUBSTRATE, METHOD FOR FORMING HOLE IN GLASS SUBSTRATE, AND APPARATUS FOR FORMING HOLE IN GLASS SUBSTRATE
MANUFACTURING METHOD FOR GLASS SUBSTRATE, METHOD FOR FORMING HOLE IN GLASS SUBSTRATE, AND APPARATUS FOR FORMING HOLE IN GLASS SUBSTRATE
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机译：玻璃基板的制造方法，在玻璃基板中形成孔的方法以及在玻璃基板中形成孔的装置
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摘要
A manufacturing method for a glass substrate having a hole with a depth of d (μm) or more includes irradiating the glass substrate with a laser beam emitted from a CO2 laser oscillator for an irradiation time t (μsec), to form a hole in the glass substrate. The laser beam is delivered to the glass substrate after being condensed at a focusing lens. A power density Pd (W/cm2), defined by; Pd=P0/S ;where P0 and S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cm2 or less. The irradiation time t (μsec) satisfies; t≧10×d/Pd)1/2.
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机译：具有深度为d（μm）或更大的孔的玻璃基板的制造方法包括用从CO 2 激光振荡器发射的激光束照射玻璃基板照射时间t（μsec） ），在玻璃基板上形成孔。在聚焦透镜处会聚之后，激光束被传送到玻璃基板。功率密度P d （W / cm 2 ），定义为： <？in-line-formulae description =“在线公式” end =“线索”？> P d = P 0 / S <？in-line-formulae description =“在线公式” end =“ tail”？> ;其中P 0 和S分别是刚进入聚焦透镜之前的功率和激光束的光束横截面积，为600 W / cm 2 或更少。照射时间t（μsec）满足。 <？in-line-formulae description =“在线公式” end =“线索”？> t ≧10× d / P d ） 1/2 。<？in-line-formulae description = “在线公式” end =“ tail”？>
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