首页> 外国专利> Method for quickly full-scale analyzing and designing the processing parameters and deposit strategy on temperature field for 3D printing/Additive manufacturing

Method for quickly full-scale analyzing and designing the processing parameters and deposit strategy on temperature field for 3D printing/Additive manufacturing

机译:快速全面分析设计3D打印/增材制造工艺参数和温度场沉积策略的方法

摘要

A method of modelling and simulating the full-scale temperature distribution, temperature gradient and cooling rate for 3D printing (additive manufacturing) a part or multi-parts throughout the additive manufacturing procedure on the basis of layerwise block technique is disclosed and claimed. The method enables to model the deposition part(s) with the various profiles as multi-different blocks by introducing the multi-blocks model and then reduce the 3D simulation problem to a 2D simulation problem by laminated block approach. Thus, the method can reduce the computational work and realize the quick simulation and analysis of the effect of processing parameters and deposit strategy on the full-scale temperature distribution, temperature gradient and cooling rate in the additive manufacturing deposition track-by-track and layer-by-layer, further help people to design the processing parameters and deposit strategy through full-scale temperature field change.
机译:公开并要求保护一种基于分层块技术对整个增材制造过程中的一个或多个零件进行3D打印(增材制造)的全尺寸温度分布,温度梯度和冷却速率的建模和仿真方法。该方法使得能够通过引入多块模型而将具有多个轮廓的沉积部分建模为多不同块,然后通过层压块方法将3D仿真问题简化为2D仿真问题。因此,该方法可以减少计算工作量,并且可以快速模拟和分析工艺参数和沉积策略对增材制造逐层沉积和逐层沉积中的全尺寸温度分布,温度梯度和冷却速率的影响。通过全面的温度场变化,进一步帮助人们设计工艺参数和沉积策略。

著录项

  • 公开/公告号US2017212979A1

    专利类型

  • 公开/公告日2017-07-27

    原文格式PDF

  • 申请/专利权人 JINQUAN CHENG;

    申请/专利号US201514921640

  • 发明设计人 JINQUAN CHENG;

    申请日2015-10-23

  • 分类号G06F17/50;B33Y50;

  • 国家 US

  • 入库时间 2022-08-21 13:51:12

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