Metallized film, metallized film capacitor using the metallized film, and manufacturing method of the metallized film

• 1. 一种金属化隔离膜、金属化隔离膜组及金属化隔离膜电容器 [P] . 中国专利： CN113808850A . 2021-12-17
• 2. 纳米金属化合物粒子及使用了其的涂料及膜、膜的制造方法、纳米金属化合物粒子的制造方法 [P] . 中国专利： CN110325478B . 2022.03.01
• 3. METHOD OF MANUFACTURING METALLIZED FILM, METALLIZED FILM, FILM MATERIAL, METHOD OF MANUFACTURING FILM CAPACITOR, AND FILM CAPACITOR [P] . 日本专利： JP2010050387A . 2010-03-04

  机译： 金属化膜的制造方法，金属化膜，膜材料，膜电容器的制造方法以及膜电容器

• 4. METALLIZED FILM, METALLIZED FILM CAPACITOR USING METALLIZED FILM, AND METHOD FOR MANUFACTURING METALLIZED FILM [P] . 世界知识产权组织专利： WO2015037229A1 . 2015-03-19

  机译： 金属化膜，使用金属化膜的金属化膜电容器以及金属化膜的制造方法

• 5. Metallized film capacitor, manufacturing method of metallized film capacitor, and metallized film laminate [P] . 美国专利： US10079107B2 . 2018-09-18

  机译： 金属化膜电容器，金属化膜电容器的制造方法以及金属化膜层叠体

• 1. Fatigue of metals at nanoscale:Metal thin films and conductive interconnects for flexible device application [J] . XueMei Luo, Bin Zhang, GuangPing Zhang 纳米材料科学(英文版) . 2019,第003期
• 2. Studying the Application and Advances of Diffusive Gradients in-Thin Films Techniques (DGTs) to Constrain Mobility and Bioavailability of Heavy Metals in Soils [J] . Georges Martial Ndzana, Alex Dortie Kolleh, Kashif Ali Kubar, 地球科学和环境保护期刊（英文） . 2021,第005期
• 3. A review on photoelectrochemical cathodic protection semiconductor thin films for metals [J] . Yuyu Bu, Jin-Ping Ao 绿色能源与环境（英文） . 2017,第004期
• 4. A review on photoelectrochemical cathodic protection semiconductor thin films for metals [J] . Yuyu Bu, Jin-Ping Ao 绿色能源与环境：英文版 . 2017,第004期
• 5. Preparation of rare earth CeO_2 thin films using metal organic decomposition method for metal-oxide-semiconductor capacitors [J] . Agrawal Khushabu S., Patil Vilas S., Khairnar Anil G., Journal of materials science . 2017,第17期
• 6. Investigation of the Divided Deposition Method of TiN Thin Films for Metal-Insulator-Metal Capacitor Applications [J] . Tomonori Okudaira, Takeshi Hayashi, Shinsuke Sakashita, Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers . 2005,第11期
• 7. Toray to Up Output of Metallized Films Used in Film Capacitors [J] . Japan Chemical Week Group Japan Chemical Week . 2009,第2506期
• 8. The friction behavior of BOPP capacitor films I film for metallization (M film) [C] . Shaohui Huang, Qingyi Deng, Qunzhao Wang Pacific polymer conference preprints . 1999
• 9. Synthesis and characterization of amidate, carbohydrazide, and amidrazonate complexes of group 4 and first row transition metals as potential precursors for Atomic Layer Deposition of metal and metal oxide thin films [D] . Karunarathne, Mahesh Chinthaka 2010
• 10. Thin Metal Films: A Method to Form Smooth Films of Liquid Metal Supported by Elastomeric Substrate (Adv. Sci. 10/2018) [O] . Arthur Hirsch, Stéphanie P. Lacour 2018
• 11. Effect of Film Thickness and Electrode Area on the Dielectric Breakdown Characteristics of Metallized Capacitor Films [O] . Ilkka Rytöluoto, Kari Lahti 2018
• 12. Foeranging av Tunna Metallfilmer med Laserstralning. En Studie av Laempliga Metaller och Filmtojocklekar i Optiska Sekringar (Evaporation of Thin Metal Films by Laser Radiation). [R] . Senneryd, P. 2001

• 1. THE MECHANISM OF SURFACE METALLIZATION OF POLYVINYL ALCOHOL COMPLEX METAL CHELATE FILMS [J] . Ding Sheng YU Shi Zhi CHEN Shu Ke JIAO . 中国化学快报：英文版 . 1993,第9期
• 2. 电容器用粗化金属化BOPP膜的开发及应用 [C] . CHU Song-chao ,储松潮 ,PAN Yu-xian . 陕西省电网节能与电能质量技术学会2017年学术交流会 . 2017
• 3. 无封装金属化聚萘乙酯膜叠片式电容器的研究 [A] . 张世梅 . 2011