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Method for manufacturing translucent hard substrate laminate and translucent hard substrate laminating apparatus

机译：半透明硬质基板积层体的制造方法及半透明硬质基板积层装置

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摘要

Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, the entire fixing agent spreading between the both translucent rigid substrates is cured every time the translucent rigid substrates are bonded.

机译：提供一种制造半透明刚性基板层压体的方法，该方法可以提高位置精度。还提供了一种半透明的刚性基板接合装置，其在提高板状产品的生产效率的同时有助于提高位置精度。在根据本发明的半透明刚性基板层压体的制造方法和半透明刚性基板粘合装置中，当通过插入包含（A）多官能（甲基）的光固化性固定剂而以预定的位置关系粘合半透明刚性基板时。丙烯酸酯，（B）单官能（甲基）丙烯酸酯和（C）之间的光聚合引发剂，每当粘合半透明刚性基材时，固化分散在两个半透明刚性基材之间的整个固定剂。

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公开/公告号JP6050751B2

专利类型
公开/公告日2016-12-21

原文格式PDF
申请/专利权人デンカ株式会社;
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申请/专利号JP20130524716
发明设计人栗村啓之;
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申请日2012-07-13
分类号B29C65/48;C03C27/12;G02F1/1333;G02F1/13;
国家 JP
入库时间 2022-08-21 13:53:29

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