Electroless tin or tin alloy plating solution and electronic components using the plating solution to form a tin or tin alloy coating

• 1. 在锌或锌合金镀层上形成不含六价铬的黑色转化膜的处理溶液以及在锌或锌合金镀层上形成不含六价铬的黑色转化膜的方法 [P] . 中国专利： CN100457969C . 2009.02.04
• 2. 在锌或锌合金镀层上形成不含六价铬的黑色转化膜的处理溶液以及在锌或锌合金镀层上形成不含六价铬的黑色转化膜的方法 [P] . 中国专利： CN1729311A . 2006-02-01
• 3. ELECTROLESS TIN OR TIN-ALLOY PLATING SOLUTION AND ELECTRONIC PART WITH TIN OR TIN-ALLOY COATING FILM FORMED FROM THE PLATING SOLUTION [P] . 世界知识产权组织专利： WO2010074067A1 . 2010-07-01

  机译： 无锡镀锡或锡合金镀层溶液以及由镀层溶液制成的带锡或锡合金镀膜的电子零件

• 4. Co-W alloys electroless plating solution, electroless plating method using the same and Co-W alloys coating layer prepared by the same [P] . 韩国专利： KR101176221B1 . 2012-08-22

  机译： Co-W合金化学镀液，使用其的化学镀方法以及由其制备的Co-W合金涂层

• 5. COBALT-TUNGSTEN ALLOY ELECTROLESS PLATING SOLUTION, ELECTROLESS PLATING METHOD USING THE SAME, AND COBALT-TUNGSTEN ALLOY COATING LAYER MANUFACTURED BY THE SAME [P] . 韩国专利： KR20110123021A . 2011-11-14

  机译： 钴钨合金化学镀液，使用该合金的化学镀方法以及由该合金制造的钴钨合金镀层

• 1. Structure and wear resistance of TiN and TiAlN coatings on AZ91 alloy deposited by multi-arc ion plating [J] . 赵晖, 王晓辉, 刘秋雷, 中国有色金属学报：英文版 . 2010,第0S2期
• 2. Structure and wear resistance of TiN and TiAlN coatings on AZ91 alloy deposited by multi-arc ion plating [J] . 赵晖, 王晓辉, 刘秋雷, 中国有色金属学报：英文版 . 2010,第B07期
• 3. Corrosion behaviors of electroless plating Ni-P coatings deposited on magnesium alloys in artificial sweat solution [J] . Y. W. Song, D. Y. Shan, E. H. Han Electrochimica Acta . 2007,第4期
• 4. The effect of component concentrations in electroless nickel plating solution on topography and microrelief of Ni-P coatings [J] . Petulkhovz IV Russian journal of electrochemistry . 2008,第2期
• 5. Effect of Pickling and Activation Treatments on the Performance of Electroless Plating of Ni-B Coating on AZ31 Mg Alloy [J] . Salah Eldin k. A. Abdulhamid, Fatma Kandemirli, Ibrahim M Ghayad Chemistry and Materials Research . 2019,第5期
• 6. Preparation and characterization of Pd-Ag alloy membranes via simultaneous plating by continuous addition of Ag to the electroless plating solution [C] . D.A. Pacheco Tanaka, E. Fernandez, J. Zuniga Euromembrane Conference . 2013
• 7. The structure and composition of an electroplated gold-tin solder alloy co-deposited by pulse plating from solutions containing ethylendiamine as a stabilizer [D] . Doesburg, Jacobus Cornelis 2000
• 8. On the Formation of AlNiCo Nano-Quasicrystalline Phase during Mechanical Alloying through Electroless Ni-P Plating of Starting Particles [O] . Seyedmehdi Hosseini, Pavel Novák 2019
• 9. Preparation and Characterization of Pd-Ag Alloy Membranes via Simultaneous Plating by Continuous Addition of Ag to the Electroless Plating Solution [O] . Tanaka D.A. Pacheco, Fernández E., Zúñiga J., 2012
• 10. Chromium/Molybdenum Alloy Plating. Part 1: The Electrodeposition of Low Contraction Chromium/Molybdenum Alloys Using Unipolar (On/Off) Pulse Plating. [R] . Miller, M. D., Langston, S. 1994

• 1. Mechanical assisted electroless barrel-plating Ni-P coatings on magnesium alloy [J] . Zhaoxia PING Juntao YUAN Yedong HE Xiaogang LI . 金属学报：英文版 . 2009,第3期
• 2. Direct Electroless Nickel Plating on AZ91D Magnesium Alloy from a Sulfate Solution and its Deposition Mechanism [J] . GUChang-dong LIANJian-she LIGuang-yu NIULi-yuan JIANGZhong-hao . 材料热处理学报 . 2004,第05B期
• 3. Effect of Rare Earth Elements on Depositing Rate of Nickel Alloy Brush Plating Coatings [J] . 黄锦滨 ,朱宝亮 ,刘家浚 . 稀土学报：英文版 . 2000,第3期
• 4. 锡和锡基合金镀层的可焊性研究 [C] . 庄瑞舫 . 第六届全国电子电镀年会 . 1995
• 5. 镁合金(AZ91D)表面锡基巴氏合金镀层和镍—锡—镍镀层的研究 [A] . 王彩俊 . 2012