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Fast atom beam source, the room temperature bonding apparatus and a room temperature bonding method
Fast atom beam source, the room temperature bonding apparatus and a room temperature bonding method
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机译：快速原子束源，常温接合装置及常温接合方法
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摘要
PROBLEM TO BE SOLVED: To join a plurality of substrates more properly by activating the surface of the substrate more uniformly.SOLUTION: A high speed atomic beam source includes a housing 20, and an electrode body 21. The housing 20 has a ring shape and includes a plurality of irradiation holes 22 aligned on a surface 20p inside a ring at an equal interval or continuously. The electrode body 21 is provided inside the housing 20, and extends along the circumference of the ring. The housing 20 and the electrode body 21 are respectively constituted as a cathode and an anode which generate a saddle field type electric field inside the housing 20. The surface inside the ring in each of the plurality of irradiation holes 22 is directed to the central axis of the ring.
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