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One-part solvent-free room-temperature-curable organosiloxane-based silicone resin adhesive and a method for producing the same
One-part solvent-free room-temperature-curable organosiloxane-based silicone resin adhesive and a method for producing the same
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机译：一种无溶剂的室温可固化的有机硅氧烷基有机硅树脂粘合剂及其制备方法
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摘要
PROBLEM TO BE SOLVED: To solve the problem that the thermal conductivity λ of a conventional adhesive is at most about 2 and insufficient although a non-electroconductive heat dissipation filler is used in the adhesive to increase the thermal conductivity and to prevent an increase of the heat of an electronic component.SOLUTION: An organosiloxane-based silicone resin adhesive of present invention is a one-pack solvent-free air-dry type organosiloxane resin adhesive, modified with at least one organic resin of a non-solvent type urethane resin, a polyester resin and a urethane-modified epoxy resin. In the adhesive, two or more non-electroconductive inorganic heat dissipation fillers having a predetermined particle size are added, especially, two or more fine heat conductive fillers having a particle size of 0.4-1.5 μm are used in such a manner that the fillers are mixed, and aluminum nitride is inevitably used as one of the fillers.
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