首页> 外国专利> Adhesive for the cohesive connection of a polymeric organic material with an inorganic substrate and method for cohesive bonding of a polymeric organic material with an inorganic substrate using the adhesion promoter

Adhesive for the cohesive connection of a polymeric organic material with an inorganic substrate and method for cohesive bonding of a polymeric organic material with an inorganic substrate using the adhesion promoter

机译:用于聚合物有机材料与无机基材的粘合连接的粘合剂以及使用粘合促进剂将聚合物有机材料与无机基材粘合的方法

摘要

An adhesion promoter for the cohesive bonding of a polymeric organic material to an inorganic substrate, wherein the adhesion promoter comprises protected isocyanate compounds which are represented by the following general formula: R 1 - (CH 2) y -NH-C (O) -Z where R 1 is selected from the group consisting of Group of silanes, phosphonates or thiols is selected, Z is a protective group, and y is 0 to 24.
机译:一种用于将聚合物有机材料粘结到无机基材上的增粘剂,其中该增粘剂包括受保护的异氰酸酯化合物,其由以下通式表示:R 1-(CH 2)y -NH-C(O)-其中R 1选自硅烷,膦酸酯或硫醇的Z,其中Z为保护基,y为0至24。

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