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首页> 外国专利> POLYMER COMPOSITION WITH EXCELLENT THERMAL CONDUCTIVITY PRODUCED BY USING COMPRESSION MOLDING METHOD AND PRODUCT OF POLYMER COMPOSITION WITH EXCELLENT THERMAL CONDUCTIVITY MANUFACTURED BY USING SAME

POLYMER COMPOSITION WITH EXCELLENT THERMAL CONDUCTIVITY PRODUCED BY USING COMPRESSION MOLDING METHOD AND PRODUCT OF POLYMER COMPOSITION WITH EXCELLENT THERMAL CONDUCTIVITY MANUFACTURED BY USING SAME

机译：用压模法生产的具有优良导热性的聚合物组合物和用相同的方法制造的具有优良的导热性的聚合物组合物

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摘要

The present invention provides a polymer composition including 10-90 wt% of a heat resistance polymer resin and 10-90 wt% of a theromoconductive filler with respect to the total weight of the polymer composition. The thermoconductive filler has anisotropy. The polymer composition is obtained by mixing, compressing, and molding the heat resistance polymer resin in a powder type with the thermoconductive filler. According to the present invention, the polymer composition includes the thermoconductive filler, which has an excessive amount of anisotropy and is uniformly dispersed in the polymer composition compared to an existing composition. An effective network between the fillers is formed by using the thermoconductive filler, which is uniformly dispersed and has anisotropy. Therefore, a contact ratio is increased, and thermal conductivity is very excellent. In addition, the polymer composition can be widely used in an electronic component industry and a semiconductor industry as a commercialized filler is used and a production process is simple.;COPYRIGHT KIPO 2016
机译：本发明提供了一种聚合物组合物，其相对于该聚合物组合物的总重量包含10-90重量％的耐热性聚合物树脂和10-90重量％的导热性填料。导热填料具有各向异性。该聚合物组合物通过将粉末状的耐热性高分子树脂与导热性填料混合，压缩，成型而得到。根据本发明，该聚合物组合物包括导热填料，该导热填料与现有组合物相比具有过量的各向异性并且均匀地分散在该聚合物组合物中。通过使用均匀分散并且具有各向异性的导热填料，在填料之间形成有效的网络。因此，增加了接触比，并且导热率非常好。此外，该聚合物组合物可广泛用于电子元件行业和半导体行业，因为它使用了商业化的填料，并且生产工艺简单。

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