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METHOD FOR THE PRODUCTION OF A BONDABLE METAL COATING FOR SMALL COPPER RIBBON BONDS OR LARGE-DIAMETER COPPER WIRE BONDS ON A SEMICONDUCTOR SUBSTRATE, COMPRISING A SINTERED COPPER METAL COAT, AND CORRESPONDING BONDABLE METAL COATING
METHOD FOR THE PRODUCTION OF A BONDABLE METAL COATING FOR SMALL COPPER RIBBON BONDS OR LARGE-DIAMETER COPPER WIRE BONDS ON A SEMICONDUCTOR SUBSTRATE, COMPRISING A SINTERED COPPER METAL COAT, AND CORRESPONDING BONDABLE METAL COATING
The invention relates to a bondable metal coating (1) on a semiconductor substrate (3) for a power semiconductor device and to a method for the production thereof, said bondable metal coating (1) having a first metal layer (M1) that is applied to the semiconductor substrate (3), and a second metal layer (M2) that is applied to the first metal layer (M1) and is designed as a printed and sintered copper metal coat (Cu). According to the invention, in order to form the second metal layer (M2), a paste or ink comprising copper nanoparticles is printed onto the first metal layer (M1) and is sintered using a thermal process such that a copper metal coat (Cu) is obtained. This makes it possible to form a suitable copper metal coat (Cu) for a bond pad (10) for small copper ribbon bonds and large-diameter copper wire bonds. In order to form the copper metal coat (Cu), the second metal layer (M2) is printed onto the first metal layer (M1) with a predefined structure, or the copper metal coat (Cu) is structured using a photolithographic process following the thermal sintering process. For passivation purposes, an additional at least single-layer metal coating can be applied to the copper metal coat (Cu) using electroless chemical deposition, electrodeposition, or chemical or physical vapor deposition.
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