Provided are a thermoset resin sandwiched pre-preg body, copper clad plate made thereof and multilayer printed circuit wiring board. The interlayer of the thermoset resin sandwiched pre-preg body contains a high filler content thermoset resin composition, and the outer layer of the pre-preg body contains a low filler content thermoset resin composition. The copper clad plate made of the pre-preg body has good adhesion and insulation with metal foil, and uniform distribution of a dielectric constant.
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