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composite structure, drafting process, settlement process and film

机译:复合结构,起草过程,结算过程和胶片

摘要

Disclosed herein are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, at least a portion of which is made of a surface resin composition, selected from polyamide compositions comprising a blend of two or more fully aliphatic polyamides having a melting point of at least 250° C., and comprising a fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition is selected from polyamide compositions comprising a one or more fully aliphatic polyamides having a melting point of at least 250° C.
机译:本文公开了包覆成型的聚酰胺复合材料结构及其制备方法。所公开的包覆成型的复合结构包括:i)具有表面的第一组分,该表面的至少一部分由表面树脂组合物制成,该表面树脂组合物选自聚酰胺组合物,该聚酰胺组合物包含两种或更多种熔点至少为25的全脂族聚酰胺的混合物。 250°C,并且包含纤维材料,该纤维材料浸渍有基质树脂组合物,ii)第二组分,其包含包覆成型树脂组合物,其在所述第一组分的至少一部分表面上粘附至所述第一组分,并且其中基质树脂组合物选自包含一种或多种熔点至少为250℃的全脂族聚酰胺的聚酰胺组合物。

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