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On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
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机译:具有特性阻抗调整技术的片上垂直三维微带线和设计结构
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摘要
A vertical three dimensional (3D) microstrip line structure for improved tunable characteristic impedance, methods of manufacturing the same and design structures are provided. More specifically, a method is provided that includes forming a first microstrip line structure within a back end of the line (BEOL) stack. The method further includes forming a second microstrip line structure separated from the BEOL stack by a predetermined horizontal distance.
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