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Methods for converting planar designs to FinFET designs in the design and fabrication of integrated circuits

机译:在集成电路的设计和制造中将平面设计转换为FinFET设计的方法

摘要

Methods for converting planar designs to FinFET designs in the design and fabrication of integrated circuits are provided. In one embodiment, a method for converting a planar integrated circuit design to a non-planar integrated circuit design includes identifying a rectangular silicon active area in the planar integrated circuit design, superimposing a FinFET design grid comprising a plurality of equidistantly-spaced parallel grid lines over the rectangular silicon active area such that two sides of the rectangular silicon active area are parallel to the grid lines, and generating a rectangular active silicon marker area encompassing the silicon active area. Furthermore, the method includes generating fin mandrels longitudinally along every other grid line of the plurality of grid lines and within the active silicon marker area and the silicon active area, and removing the fin mandrels from areas of the design grid outside of the active silicon marker area.
机译:提供了用于在集成电路的设计和制造中将平面设计转换为FinFET设计的方法。在一个实施例中,一种用于将平面集成电路设计转换为非平面集成电路设计的方法包括:在平面集成电路设计中识别矩形硅有源区域,叠加包括多条等距间隔的平行网格线的FinFET设计网格。在矩形硅有源区域上覆盖矩形硅有源区域,使得矩形硅有源区域的两侧平行于网格线,并产生包围硅有源区域的矩形有源硅标记区域。此外,该方法包括:沿着多条网格线中的每隔一条网格线在有源硅标记器区域和硅有源区域内纵向地生成翅片芯轴;以及从有源硅标记器之外的设计网格区域中去除翅片芯轴。区。

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