首页> 外国专利> Method for preparing low-melting-point plating solution for aluminum electroplating, plating solution for aluminum electroplating, method for producing aluminum foil, and method for lowering melting point of plating solution for aluminum electroplating

Method for preparing low-melting-point plating solution for aluminum electroplating, plating solution for aluminum electroplating, method for producing aluminum foil, and method for lowering melting point of plating solution for aluminum electroplating

机译：铝电镀用低熔点电镀液的制备方法，铝电镀用电镀液，铝箔的制造方法以及降低铝电镀用电镀液的熔点的方法

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摘要

An object of the present invention is to provide a method for preparing a plating solution for aluminum electroplating useful for the production of a high-ductility, high-purity aluminum foil at a high film formation rate, etc., which is an easy-to-handle plating solution that does not solidify and allows for an electroplating treatment even at 25° C. The present invention as a means for achieving the object is characterized in that in a preparation of a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, the blending proportions of the dialkyl sulfone, the aluminum halide, and the nitrogen-containing compound are such that per 10 mol of the dialkyl sulfone, the aluminum halide is 3.5+n to 4.2+n mol, and the nitrogen-containing compound is n mol (wherein n is 0.001 to 2.0 mol). In addition, a plating solution for aluminum electroplating prepared by the method of the present invention allows for an electroplating treatment with high aluminum deposition efficiency relative to the current flow, and is thus advantageous in that electricity usage can be reduced, resulting in excellent economic efficiency.

机译：本发明的一个目的是提供一种制备铝电镀用镀液的方法，该方法可用于以高成膜速率等生产高延展性，高纯度的铝箔等。 -即使在25℃下也不会固化并能够进行电镀处理的电镀处理液。作为实现上述目的的手段，本发明的特征在于，在制备至少包含（1）二烷基砜的电镀液中，（2）卤化铝和（3）含氮化合物，二烷基砜，卤化铝和含氮化合物的混合比例为每10摩尔二烷基砜，卤化铝N为3.5 + n至4.2 + nmol，且含氮化合物为nmol（其中n为0.001至2.0mol）。另外，通过本发明的方法制备的用于铝电镀的电镀液允许相对于电流以高的铝沉积效率进行电镀处理，因此其优点在于可以减少用电量，从而导致优异的经济效率。。

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公开/公告号US9382634B2

专利类型
公开/公告日2016-07-05

原文格式PDF
申请/专利权人 HITACHI METALS LTD.;
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申请/专利号US201314381753
发明设计人 ATSUSHI OKAMOTO;JUNICHI MATSUDA;
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申请日2013-02-27
分类号C25D3/44;C25D3/66;C25D1/04;H01G11/68;H01G11/84;H01M4/66;H01M10/0525;
国家 US
入库时间 2022-08-21 14:28:50

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