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High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB)
High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB)
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机译：封装基板或印刷电路板（PCB）中的高品质因数电感器和高品质因数滤波器
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摘要
A package substrate (or printed circuit board) that includes at least one dielectric layer, a first inductor structure is at least partially located in the dielectric layer, a third interconnect, and a second inductor structure. The first inductor structure includes a first interconnect, a first via coupled to the first interconnect, and a second interconnect coupled to the first via. The third interconnect is coupled to the first inductor structure. The third interconnect is configured to provide an electrical path for a ground signal. The second inductor structure is at least partially located in the dielectric layer. The second inductor is coupled to the third interconnect. The second inductor structure includes a fourth interconnect, a second via coupled to the fourth interconnect, and a fifth interconnect coupled to the second via. The first and second inductor structures are configured to operate with a capacitor as a 3rd harmonic suppression filter.
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