首页> 外国专利> METHOD OF PERSISTENT CURRENT MODE SPLICING OF 2G ReBCO HIGH TEMPERATURE SUPERCONDUCTORS USING SOLID STATE PRESSURIZED ATOMS DIFFUSION BY DIRECT FACE-TO-FACE CONTACT OF HIGH TEMPERATURE SUPERCONDUCTING LAYERS AND RECOVERING SUPERCONDUCTIVITY BY OXYGENATION ANNEALING

METHOD OF PERSISTENT CURRENT MODE SPLICING OF 2G ReBCO HIGH TEMPERATURE SUPERCONDUCTORS USING SOLID STATE PRESSURIZED ATOMS DIFFUSION BY DIRECT FACE-TO-FACE CONTACT OF HIGH TEMPERATURE SUPERCONDUCTING LAYERS AND RECOVERING SUPERCONDUCTIVITY BY OXYGENATION ANNEALING

机译：固态加压原子扩散直接通过高温超导层的面对面接触和通过氧恢复超导性的固态加压原子在2G ReBCO高温超导体上进行持续电流模式拼接的方法

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摘要

Disclosed is a method of splicing ReBCO high temperature superconductors (HTSs), which ensures excellent superconductivity after splicing. The method of splicing 2G ReBCO HTSs allows a superconductors-spliced assembly to exhibit excellent superconductivity by direct contact of high temperature superconducting layers of two strands of 2G ReBCO HTSs and solid state atoms diffusion pressurized splicing there between at a ReBCO below peritectic reaction temperature in a vacuum, and enables loss of superconductivity caused by loss of oxygen due to transport and out-diffusion of oxygen to atoms during splicing to be recovered through oxygenation annealing.

机译：公开了一种拼接ReBCO高温超导体（HTS）的方法，其确保了拼接后的优异超导性。拼接2G ReBCO HTS的方法允许超导体拼接的组件通过两束2G ReBCO HTS的高温超导层与固态原子的扩散加压拼接而形成优异的超导性，而固态原子在低于包晶反应温度的ReBCO之间扩散加压拼接。真空，并且能够使由于氧在连接过程中由于向原子的传输和向外扩散而导致的氧损失所引起的超导性损失得以通过氧合退火来恢复。

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公开/公告号US2015357089A1

专利类型
公开/公告日2015-12-10

原文格式PDF
申请/专利权人 K. JOINS. INC.;
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申请/专利号US201414170858
发明设计人 YOUNG-KUN OH;HEE-SUNG ANN;MYUNG-WHON LEE;
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申请日2014-02-03
分类号H01B12/06;H01R43/16;H01R4/02;H01L39/12;H01L39/24;
国家 US
入库时间 2022-08-21 14:31:41

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