首页> 外国专利> DOWNHOLE DISTRIBUTED SENSOR ARRAYS FOR MEASURING AT LEAST ONE OF PRESSURE AND TEMPERATURE, DOWNHOLE DISTRIBUTED SENSOR ARRAYS INCLUDING AT LEAST ONE WELD JOINT, AND METHODS OF FORMING SENSOR ARRAYS FOR DOWNHOLE USE INCLUDING WELDING

DOWNHOLE DISTRIBUTED SENSOR ARRAYS FOR MEASURING AT LEAST ONE OF PRESSURE AND TEMPERATURE, DOWNHOLE DISTRIBUTED SENSOR ARRAYS INCLUDING AT LEAST ONE WELD JOINT, AND METHODS OF FORMING SENSOR ARRAYS FOR DOWNHOLE USE INCLUDING WELDING

机译：用于测量至少一个压力和温度的井下分布式传感器阵列，包括至少一个焊接点的井下分布式传感器阵列以及形成用于包括焊接在内的井下传感器阵列的方法

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摘要

A downhole sensor array includes sensor housings, and each sensor housing contains one or more of a pressure sensor and a temperature sensor. Cable segments connect the sensor housings. A weld joint bonds a sensor housing to a jacket of a cable segment, and a conductor of the cable segment and the jacket of the cable segment may be separated by a void proximate the weld joint. Methods relate to forming such sensor arrays.

机译：井下传感器阵列包括传感器壳体，并且每个传感器壳体包含压力传感器和温度传感器中的一个或多个。电缆段连接传感器外壳。焊接接头将传感器壳体结合到电缆段的护套，并且电缆段的导体和电缆段的护套可以通过靠近焊接接头的空隙分开。方法涉及形成这种传感器阵列。

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公开/公告号US2016123135A1

专利类型
公开/公告日2016-05-05

原文格式PDF
申请/专利权人 DELAWARE CAPITAL FORMATION INC.;
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申请/专利号US201514923756
发明设计人 BRIAN T. LEEFLANG;G. SCOTT BROWN;
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申请日2015-10-27
分类号E21B47/06;B23K31/02;
国家 US
入库时间 2022-08-21 14:34:46

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