首页> 外国专利> MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION AFTER A WET CLEANING PROCESS

MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION AFTER A WET CLEANING PROCESS

机译:微机电系统(MEMS)结构,可防止湿式清洗过程后产生粘滞现象

摘要

A method for manufacturing a microelectromechanical systems (MEMS) structure with sacrificial supports to prevent stiction is provided. A first etch is performed into an upper surface of a carrier substrate to form a sacrificial support in a cavity. A thermal oxidation process is performed to oxidize the sacrificial support, and to form an oxide layer lining the upper surface and including the oxidized sacrificial support. A MEMS substrate is bonded to the carrier substrate over the carrier substrate and through the oxide layer. A second etch is performed into the MEMS substrate to form a movable mass overlying the cavity and supported by the oxidized sacrificial support. A third etch is performed into the oxide layer to laterally etch the oxidized sacrificial support and to remove the oxidized sacrificial support. A MEMS structure with anti-stiction bumps is also provided.
机译:提供了一种用于制造具有牺牲支撑以防止粘滞的微机电系统(MEMS)结构的方法。对载体衬底的上表面执行第一蚀刻以在腔中形成牺牲支撑。进行热氧化工艺以氧化牺牲支撑物,并形成衬在上表面并包括被氧化的牺牲支撑物的氧化物层。 MEMS衬底在载体衬底上方并通过氧化物层结合到载体衬底。在MEMS基板中进行第二次蚀刻,以形成覆盖腔体并由氧化牺牲支撑体支撑的可移动块。在氧化物层中进行第三次蚀刻,以横向蚀刻氧化的牺牲性支撑物并去除氧化的牺牲性支撑物。还提供了具有抗粘着凸起的MEMS结构。

著录项

  • 公开/公告号US2016318753A1

    专利类型

  • 公开/公告日2016-11-03

    原文格式PDF

  • 申请/专利权人 TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.;

    申请/专利号US201514699070

  • 发明设计人 CHUNG-YEN CHOU;

    申请日2015-04-29

  • 分类号B81B3;B81C1;

  • 国家 US

  • 入库时间 2022-08-21 14:38:19

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